T4W Polishing sponge waffle 150×25mm velcro black

Polishing Pad T4W is designed for efficient polishing of painted coatings. It is adapted to existing on the market polishing systems, which work with both rotary and orbital machines, wet and dry and speed range 300-2500rpm.

Specific shape minimizes signs of spin / holograms.

Features:

• White pad is designed for use with first and second step polishing compounds. Foam structure maintains the compound on the surface of the sponge which provides accurate developing particles and full utilization of the compound
• Orange pad is designed for use with first and second step polishing compounds. Foam structure maintains the paste on the surface of the sponge what provides accurate developing particles and full utilization of the paste
• Yellow pad is designed to work with the second step polishing compounds. Foam structure maintains the paste on the surface of the pad which provides accurate developing particles and full utilization of the paste
• Black polishing pad is designed to work with last step polishing compounds. The structure of the foam quickly gives off heat.

Foam:

• Optimal selected shapes
• The homogeneous structure of high strength
• Specially shaped surface
• Proper hardness

Mounting:

• Velcro – Polyamide velor to ensure strong connection

Connection:

• Adhesive is matched individually to the bonded substrates.
• Resistance to temperature, aqueous environment and organic solvents

The product shows the resistance to prolonged exposure to temperatures up to 110 ° C.